Press-fit zones as innovative solderless connection technology

What is press-fit technology?

Press-fit technology is the insertion of component connection pins – especially from connectors or single contacts – into the metallized holes of a printed circuit board (PCB). The contact between the press-fit pin and the wall of the hole is gas-tight and is characterized by good conductivity. The condition is that the press-fit pin has a larger diagonal than the hole diameter on the PCB. The deformation of the press-fit pin and the printed circuit board creates a positive connection.
Product applications
In general, press-fit zones are used by the customer in the following applications:
- Single pin insertion
- Edge connectors
- Overmolded plastic housings
Advantages
Press-fit technology is an innovative and highly reliable solution, offering considerable advantages compared to conventional soldering technology:
- No soldering errors, no flux problems
- No need for additional washing
- No thermal loads on the PCB or electronic components
- Quick and cost-efficient PCB assembly
- Double-sided PCB assembly possible
- Recycling by simply pressing out the pins
Innovation for the automotive industry

While the majority of the components in the automotive industry are currently still processed using conventional soldering methods, the future definitely lies in press-fit technology. Contacts with a flexible press-fit zone are increasingly finding application in the automotive industry.

We manufacture press-fit zones (EPZ) for the automotive industry with material thicknesses of 0.4 mm / 0.6 mm / 0.8 mm / 1.0 mm and 1.2 mm. Depending on the requirements regar-ding ambient temperature and electrical conductivity, either standard surfaces or our special surfaces for press-fit zones may be used. Our flexible press-fit zone types EPZ EE and EPZ EloPin can be used in PCBs with metallized holes according to IPC-9797 and DIN EN 60352-5 and according to customer specifications.
Development & Qualification
In our test laboratory, we carry out all major tests for assessing the press-fit connection. The laboratory works according to DIN EN 60352-5 / IPC-9797 as well as to customer specifications. The scope of tests, the procedure and the characteristic values can be agreed upon with the customer, relevant to the application.

We offer the following tests in our laboratory:
- Visual and dimension inspections
- 3D image recording
- Insertion and push-out force
- Micro sectioning and analysis
- Contact resistance
- Rapid change of temperature (temperature shock)
- Climate sequence (cold, dry and damp heat, cyclical)
- Whisker test
- Etching technology
We are working on the development of new press-fit zones as well as on the continuous improvement of existing designs. For this purpose we use modern technologies such as FEM and 3D printing.
Quality

We are committed to ensuring the quality of the press-fit zone. During serial production, continuous process monitoring is carried out using state-of-the-art camera systems and 3D measuring machines. One of the most important characteristics of a press-fit area is the deformation behavior (deformation curve) and the resulting force exerted on the hole wall of the printed circuit board. Depending on the requirements, we determine and evaluate the maximum normal force or the deformation characteristic during production.

DMA has in-house prototyping capacities using a multitude of existing tools. Prior to series production, it is thereby possible to produce sample parts with our press-fit zones under near-series conditions and to align them to the special requirements of our customers.

During the product development stage, we specify the primary influencing parameters, such as prematerial, press-fit zone geometry and surface coating, and subsequently monitor these in series production. We provide advice and support to our customers at every stage of the project.

In our test laboratory, we can check and validate the important characteristic values according to DIN EN 60352-5. To do this, a range of testing and measuring equipment is available. The use of test or series printed circuit boards for determining and adjusting press-fit-zone parameters is possible.

Download Brochure (PDF)

Standard solution for SPI pins

Additionally to customer-specific press-fit contacts, we offer a standard solution, also at the level of the automotive supplier industry. With our standardized pins for Single Pin Insertion (SPI) applications, you benefit from a short delivery time and an advantageous price/performance ratio, as investment costs for stamping tools are eliminated.

For material thicknesses of 0.4 mm, 0.6 mm and 0.8 mm, contact pins with our flexible press-fit zones are available in various connector lengths and surface platings.

Advantages

With our standardized press-fit pins, you benefit from our many years of experience in the production of customized press-fit pins, which is reflected not only in the tooling technology, but also in our internal stamping and coating processes:

Ideal for series production, but also for prototypes, pre-production and small production runs
No investment costs for tools
Short delivery times
Choice of typical material thicknesses, connector widths and lengths
Various coating combinations
Component test documentation and qualification documents available on request
Sample strips available

Press-fit Zone EE08	Pin Width
Press-fit Zone EE08	1.5 mm	2.8 mm	4.8 mm	6.3 mm
Drawing	PDF	PDF	PDF	PDF
Data Sheet	PDF	PDF	PDF	PDF

Press-fit Zone EE06	Pin Width
Press-fit Zone EE06	0.63 mm	1.2 mm	1.5 mm
Drawing	PDF	PDF	PDF
Data Sheet	PDF	PDF	PDF

Press-fit Zone EE04	Pin Width
Press-fit Zone EE04	0.5
Drawing	PDF
Data Sheet	PDF

The quantity can only be determined after you have filled in all the required fields.

Quantity: approx. 2 pcs per Coil

Weight: 2 kg per Coil

Please enter your contact details and your extra requirements so that we can send you the quotation.

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There are 13 samples available

Pin thickness	Width	Length	Plating of the press-fit zones	Plating of the connector zone
0.60 mm	0.63 mm	8.50 mm	Ni mt 1-3 µm, Sn mt 0.3-1.1 µm	Ni mt 1-2.2 µm, Sn mt 1-3 µm
0.60 mm	1.20 mm	10.50 mm	Ni mt 1-3 µm, DMA Adv. In 0.3-1.1 µm	Ni mt 1-2.2 µm, Sn mt 1-3 µm
0.60 mm	1.20 mm	10.50 mm	Ni mt 1.3-2.2 µm, DMA Adv. AgSn 0.35-0.75 µm	Ni mt 1-2.2 µm, Sn mt 1-3 µm
0.60 mm	1.20 mm	10.50 mm	Ni mt 1-3 µm, Sn mt 0.3-1.1 µm	Ni mt 1-2.2 µm, Sn mt 1-3 µm
0.80 mm	2.80 mm	10.50 mm	Ni mt 1.3-2.2 µm, DMA Adv. AgSn 0.35-0.75 µm	Ni mt 1-2.2 µm, Sn mt 1-3 µm
0.80 mm	2.80 mm	11.50 mm	Ni mt 1-3 µm, DMA Adv. In 0.3-1.1 µm	Ni mt 1-2.2 µm, Sn mt 1-3 µm
0.80 mm	0.63 mm	10.50 mm	Ni mt 1-3 µm, DMA Adv. In 0.3-1.1 µm	Ni mt 1-2.2 µm, Sn mt 1-3 µm
0.80 mm	0.63 mm	10.50 mm	Ni mt 1.3-2.2 µm, DMA Adv. AgSn 0.35-0.75 µm	Ni mt 1-2.2 µm, Sn mt 1-3 µm
0.40 mm	0.50 mm	10.50 mm	Ni mt 1-3 µm, DMA Adv. In 0.3-1.1 µm	Ni mt 1-2.2 µm, Sn mt 1-3 µm
0.80 mm	0.63 mm	10.50 mm	Ni mt 1-3 µm, Sn mt 0.3-1.1 µm	Ni mt 1-2.2 µm, Sn mt 1-3 µm
0.60 mm	1.50 mm	10.50 mm	Ni mt 1-3 µm, Sn mt 0.3-1.1 µm	Ni mt 1-2.2 µm, Sn mt 1-3 µm
0.80 mm	1.50 mm	11.50 mm	Ni mt 1-3 µm, DMA Adv. In 0.3-1.1 µm	Ni mt 1-2.2 µm, Sn mt 1-3 µm
0.80 mm	4.80 mm	11.50 mm	Ni mt 1-3 µm, Sn mt 0.3-1.1 µm	Ni mt 1-2.2 µm, Sn mt 1-3 µm