Stanztec: New Technologies in Plating and Stamping
The trade fair Stanztec in Pforzheim with around 3,500 trade visitors and 160 exhibitors once again focused on the high-end stamping technologies.
Diehl Metal Applications and Sundwiger Messingwerk made their fourth appearance at the fair, showcasing their broad and impressive technology portfolio.
The focus was on copper alloys for strip & wire material development as well as efficient recycling solutions of Sundwiger Messingwerk. The material portfolio on show ranged from brass and bronze to low-alloyed copper, nickel silver and heat-treatable special alloys.
Besides the customary plating technologies DMA showed its wide range of the latest highly selective plating techniques also presenting Schempp+Decker Advanced Indium and Schempp+Decker Advanced Nickel, two new lead-free surface coatings for press-fit zones, which minimize whisker formation.
DMA also presented the SKEDD technology, developed by Würth Elektronik ICS, as a trade fair highlight. SKEDD is a new type of contact system for connecting components to the printed circuit board and is contributing to the miniaturization trend in the automotive industry: assembly space and weight are reduced, assembly is simplified and a sustainable recycling process is supported.
The Schempp+Decker press-fit zone provides an innovative solder-free connection technology. To meet the demand for miniaturization and power electronics, we have expanded the product portfolio to include the S+D press-fit zone EE04 (nominal hole 0.6 mm) and the S+D press-fit zone EloPin 12-20 (nominal hole 2.0 mm).
For Diehl Metal Applications the rest of the year remains exciting. From October 18 to 20, DMA will participate at IZB, the international suppliers fair at Wolfsburg. In November it will present its product portfolio at electronica in Munich. We look forward to welcoming you there!